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News
- Apr. 11th, 2025
- We will give an invited talk at ICEP-IAAC 2025, an international conference on electronics packaging technology. We will introduce the evaluation of thermal boundary conductance of semiconductor junction interface using frequency
-domain thermoreflectance microscopy.
▸ April 15 - 18, 2025 | ICEP-IAAC 2025
▸ Program - Mar. 7th, 2025
- We will present our research on thermal conductivity measurement of individual heat-dissipating filler particles at PACRIM 16 / GOMD 2025, organized by the American Ceramic Society. We will also showcase our technologies at the exhibition.
▸ May 4 - 9, 2025 | PACRIM 16 / GOMD 2025 - Feb 4th, 2025
- We will give a presentation on FDTR microscopy and its semiconductor applications at the closed meeting of the Thermal Management Research Group, which operates under the Japan Institute of Electronics Packaging (JIEP).
▸ May 24th, 2025 | Thermal Management Research Group (Japanese only)
Events
- May 14th ﹣ 17th, 2025Okinawa, Japan
- HTSJ International Heat Transfer Symposium
We will exhibit at the International Heat Transfer Symposium. We will introduce our FDTR microscope with examples of thermal conductivity measurement of heat dissipating filler particles.
▸ Official website - May 4th ﹣ 9th, 2025Vancouver, British Columbia, Canada
- PACRIM 16 / GOMD 2025
We will exhibit at PACRIM 16, organized by the American Ceramic Society. On the 7th, we will also present our research on thermal conductivity measurement of individual heat-dissipating filler particles (9:50 - 10:10, Plaza B Hyatt Regency).
▸ Official website - Apr. 18th, 11:25 - 11:50 am, 2025Nagano, Japan
- ICEP-IAAC 2025
We will give an invited talk at ICEP-IAAC 2025, the international conference on electronics packaging technology, on the evaluation of thermal boundary conductance by FDTR.
▸ Official website
▸ Program